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GIGABYTE Technology introduces innovative Glass Fabric PCB technology

Post Time:Oct 31,2011Classify:Company NewsView:315

 

The Glass Fabric PCB technology uses a new PCB material which reduces the amount of space between the fiber weave, making it much more difficult for moisture to penetrate, compared to traditional motherboard PCBs.

 

Many parts of India experience moisture in the air as ‘humidity’ almost through the year. There is nothing more harmful to the longevity of your PC than moisture. To give the ultimate protection to your PC from humidity,GIGABYTE Technology (India) Pvt. Ltd., a leading manufacturer of motherboards, has recently launched in India, a motherboard series with its new, innovative Glass Fabric PCB technology that repels moisture caused by humid and damp conditions.

 

The Glass Fabric PCB technology uses a new PCB material which reduces the amount of space between the fiber weave, making it much more difficult for moisture to penetrate, compared to traditional motherboard PCBs. This ensures a much better protection from short circuits and system malfunctions, caused by humidity. This unique kind of PCB process actually helps protect the motherboard from moisture at the PCB level, with improvements to how the actual PCB structure is manufactured.

 

The problem with traditional PCB manufacturing is a process known as Conductive Anodic Filament (CAF). This basically describes a situation where the copper conductive filament forms a laminate dielectric between the adjacent conductors. This can be a major source of electrical failure and is believed to be caused primarily by humidity or moisture, which results in a hydrolytic reaction with the copper within the motherboard with the passage of time. Moisture is believed to enter the PCB via the holes in the board where IC components are attached.

 

GIGABYTE’s Glass Fabric PCB technology that allows for a finer glass fiber weave, makes it much more difficult for moisture to penetrate, even when holes are made to mount components. 

 

In the diagram below, you can see fiberglass substrates are made up of a woven fiberglass materials. On the left you see traditional PCB with larger gaps or spaces, while on the right you can see the improved glass fabric PCB manufactured using the new process. 

 

In the lower section of the diagram above, you can also see how the PCB weave is made thinner and flatter in the example on the right. This also helps make the PCB more resistant to CAF and electrical shorting. The finer weave facilitates a flatter, tighter result which again, prevents moisture penetration and eventual shorting.

 

The new Glass Fabric PCB technology is the most important feature of the recently launched GIGABYTE Ultra Durable™ 4 Classic Motherboards. The GIGABYTE Ultra Durable™ 4 Classic technology protects your PC and components, against the four main problems that an average Indian PC user faces – Humidity, High Temperature, Power Failures and Static Electricity.

 

Source: http://www.indiainfoline.comAuthor: shangyi

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