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AGC Develops Micro-Hole Drilling Processing Technology

Post Time:Mar 30,2012Classify:Company NewsView:217

 

 

Asahi Glass Co. of Tokyo has developed ultra-high speed processing technology for micro hole drilling processing of ultra-thin glass with a thickness of 0.1 millimeter. The combination of this micro hole drilling processing technology and the production technology for ultra-thin glass has opened the door for glass to be used in applications such as laminated semiconductors.

 

Laminated semiconductors are produced by vertically stacking semiconductor chips for enhanced performance, and are connected to a printed circuit board via an interposer. This interposer needs many holes with a diameter of about 50 ?m to connect through-electrodes1 of semiconductors, etc. So far, thin sheet glass with a thickness of about 0.3 millimeters draws attention as a raw material for interposers, but it has been difficult to drill micro holes in such thin glass using conventional technologies. By applying the newly-developed micro hole drilling processing technology for ultra-thin glass to process glass interposers, AGC will be able to drill holes precisely and at high speed to connect through-electrodes.

 

Source: http://www.usgnn.comAuthor: shangyi

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