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Bystronic Glass Reports Strong Interest And Positive Lead Generation With Clear Intentions To Purchase

Post Time:Oct 11,2009Classify:Company NewsView:376

The 24 th European Photovoltaic Solar Energy Conference and Exhibition (EU PVSEC) 2009 held in Hamburg was a great success for the Bystronic glass group. "A firm order was placed with a number of customers expressing serious intentions to buy," reports Richard Jakob, CEO Bystronic glass. 
The Swiss-German specialists of glass processing machinery presented a method for efficiently encapsulating and sealing photovoltaic modules. Visitors to the exhibition were able to see the first machine for the application of high-viscous butyl on semiconductor thin-film substrates in operation: the photovoltaic TPA (Thermo Plastic Applicator).
The application of butyl is suitable for sealing of modules based on copper-indium-diselenide (Cis) or copper-indium-gallium-diselenide (CIGS) and cadmium telluride (CaTe). Depending on the film thickness, the application thickness of the butyl varies between 0.5 to 1 millimetres – using the most accurate application. Integration into complete back-end lines and existing plants is possible. Thanks to a dual drum pump system, the machine is able to operate 24 hours a day, 7 days a week. The machine is available in both horizontal and vertical options.
A lot of visitor traffic during the presentations of photovoltaic TPA and first’lase. Tobias Neff, Product Manager Solar from the Bystronic Lenhardt Technology Center, was also pleased: "The exhibition was an excellent platform to cultivate our client base. As our customers decision-makers were also among the trade fair visitors, we engaged in detailed on the spot discussions." As well as the photovoltaic TPA, Bystronic glass presented a new type of silicon module that attracted considerable public interest. "It became apparent that we are on the right track by developing the new module. Large solar companies have expressed their interest," reports Tobias Neff. 
Processing of thin film solar modules using laser technology At the 140 sqm stand (approx), the Bystronic glass group also presented a machine for laser edge deletion (LED) and laser glass cutting (TLS) of substrates for thin film solar modules. The first’laser is a joint development with Jenoptik Automatisierungstechnik. Customers can expect substantial benefits from the liaison of both companies with global interests. They can install a machine on a small footprint area which deletes glass edges without dust or damage at a previously unknown quality. A laser glass cutting process then allows the production of micro-crack-free edges with increased bending strength.
Bystronic glass media contact
Iris Minten
PR / Online Communication
c/o Bystronic Lenhardt GmbH
Karl-Lenhardt-Str. 1-9
D-75242 Neuhausen-Hamberg
Phone +49 (0)7234 601 120
Fax +49 (0)7234 601 114

Source: Bystronic GlassAuthor: shangyi

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